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Compute has a physical address.
The original educational field guide remains public at its existing routes. New explainers connect that foundation to governed claims, current source states, and explicit caveats.
Preserved field guide
The original visual chapters
The Lineage
The movement from invention to repeatable production and durable capacity control.
Open chapter →Compute has a physical address
Sites, utilities, tools, material flow, test, and packaging behind compute.
Open chapter →The building is the machine
How a fab becomes a coupled operating system.
Open chapter →From silicon to systems
The manufacturing loop from substrate to deployable system.
Open chapter →The manufacturing horizon
A grounded guide to process, packaging, resources, people, and policy.
Open chapter →Legacy source notes
The preserved source library from the educational edition.
Open chapter →Governed explainers
Research-ready foundations
What is a semiconductor fab?
A plain-language map of the factory, process-control system, and surrounding infrastructure that turn a design into repeatable silicon.
Read explainer →4 governed claimsFabless versus IDM: the old scorecard is incomplete
How ownership, outsourcing, and durable contracts distribute semiconductor manufacturing capital and risk.
Read explainer →2 governed claimsHistory of the foundry model
The educational lineage behind the fabless bargain and the renewed importance of manufacturing control.
Read explainer →3 governed claimsHow TSMC changed semiconductors
Why competitive foundry ownership and customer access can coexist, and why the quality of capacity matters.
Read explainer →4 governed claimsAMD, GlobalFoundries, and the separation of design from manufacturing
A route into the historical split and a current framework for reading capacity commitments after ownership changes.
Read explainer →5 governed claimsHow semiconductor capacity is bought
A practical taxonomy for reservations, firm purchases, prepayments, guarantees, investments, and anchor agreements.
Read explainer →3 governed claimsAdvanced packaging, CoWoS, and HBM
Why the deliverable is a qualified system, not an isolated logic die.
Read explainer →3 governed claimsSemiconductor accounting: commitments, prepayments, and inventory
How to read manufacturing exposure without turning every obligation into imaginary CapEx.
Read explainer →3 governed claimsCHIPS policy and fab ownership
A nonpartisan framework for tracing public capital to manufacturing assets, anchor customers, and execution risk.
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