Bottleneck stack
Control the narrowest qualified layer.
Manufacturing strategy extends beyond wafer starts. Each page shows what the registry can support, what still needs evidence, and which questions determine real control.
Leading-edge wafers
When qualified leading-edge capacity is concentrated, allocation itself becomes a strategic asset.
Advanced packaging
The package is part of the chip. Capacity, yield, test, and public support all affect whether silicon can ship as a system.
HBM and memory
Memory moves from commodity input to allocation market when demand, qualification, and packaging interact.
Substrates
A finished design still depends on qualified substrates and companion inputs; the narrowest layer can govern shipment volume.
Optics and networking
System throughput can be constrained outside the package, so manufacturing control must be mapped across the whole deployment path.
Power and thermal
Compute capacity is only useful when power delivery, cooling, and systems integration can support it.
Mature nodes
Scarcity and strategic value are not confined to the newest process node; qualified specialty capacity can be difficult to replace.
Export controls
Policy can strand product-specific inventory and purchase obligations before the manufacturing commitment has run off.