Company file
Tower Semiconductor
A specialty-foundry footprint across Israel, the United States, Japan, and a shared Italian facility, with an announced Japanese restructuring.
Focused research note. Tower’s official announcement documents the current footprint and a planned ownership transition.
Governed evidence
Claims in the registry
On March 25, 2026, Tower described its manufacturing footprint as one 200mm facility in Israel, two 200mm facilities in the United States, two Japanese facilities through its 51% TPSCo holding, and a shared 300mm facility in Agrate, Italy.
Caveat. Company footprint description includes jointly owned and shared-facility arrangements.
Open source
Tower announced plans to take full ownership of Japan Fab 7 (300mm) while NTCJ would take Fab 5 (200mm), with closing targeted for April 1, 2027 subject to conditions and approvals.
Caveat. Announced restructuring; target close and expansion remain subject to conditions, approvals, and execution.